Fully 3D Printed Biodegradable, Wireless, and Smart Bioimplants with Voxelated Semiconductor
Seung-Kyun Kang; Ju-Yong Lee; Jooik Jeon; Joo-Hyeon Park; Se-Hun Kang; Yea-seol Park; Min-Sung Chae; Jieun Han; Kyung-Sub Kim; Jae-Hwan Lee; Sung-Geun Choi; Sun-Young Park; Young-Seo Kim; Yoon-Nam Kim; Seung Min Lee; Myung-Kyun Choi; Jun Min Moon; Joon-Woo Kim; Seung Kwon Seol; Jeonghyun Kim
- Published
- Publisher
- Springer Science and Business Media LLC
- Research area
- Semiconductors
- Source type
- Preprint / posted paper
- DOI
- 10.21203/rs.3.rs-3631026/v1
This is a preprint or other posted paper. Check the original source for its review and publication status.
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Seung-Kyun Kang; Ju-Yong Lee; Jooik Jeon; Joo-Hyeon Park; Se-Hun Kang; Yea-seol Park; Min-Sung Chae; Jieun Han; Kyung-Sub Kim; Jae-Hwan Lee; Sung-Geun Choi; Sun-Young Park; Young-Seo Kim; Yoon-Nam Kim; Seung Min Lee; Myung-Kyun Choi; Jun Min Moon; Joon-Woo Kim; Seung Kwon Seol; Jeonghyun Kim. Fully 3D Printed Biodegradable, Wireless, and Smart Bioimplants with Voxelated Semiconductor. Springer Science and Business Media LLC. 2024-01-10. https://doi.org/10.21203/rs.3.rs-3631026/v1