Reverse Engineering of Commercial Ultrasonic Saw Blade Cutter for Cutting Semiconductor Material
Rendi Kurniawan; Shuo Chen; Hanwei Teng; Tae Ko; Pil- Han; Gi Kim; Gandjar Kiswanto
- Published
- Publisher
- Badan Kerja Sama Teknik Mesin Indonesia
- Journal / collection
- Seminar Nasional Tahunan Teknik Mesin XXII 2024
- Research area
- Semiconductors
- Source type
- Conference paper
- DOI
- 10.71452/590754
The original publisher provides the full text and its access options.
Cite this source
Rendi Kurniawan; Shuo Chen; Hanwei Teng; Tae Ko; Pil- Han; Gi Kim; Gandjar Kiswanto. Reverse Engineering of Commercial Ultrasonic Saw Blade Cutter for Cutting Semiconductor Material. Seminar Nasional Tahunan Teknik Mesin XXII 2024. 2025. https://doi.org/10.71452/590754