Live Thermal Simulation Using Digital Twin for Efficient Semiconductor Layout Design
Bin He; Gongyue Tang
- Published
- Publisher
- IEEE
- Journal / collection
- 2024 IEEE 26th Electronics Packaging Technology Conference (EPTC)
- Research area
- Semiconductors
- Source type
- Conference paper
- DOI
- 10.1109/eptc62800.2024.10909806
The original publisher provides the full text and its access options.
Cite this source
Bin He; Gongyue Tang. Live Thermal Simulation Using Digital Twin for Efficient Semiconductor Layout Design. 2024 IEEE 26th Electronics Packaging Technology Conference (EPTC). 2024-12-03. https://doi.org/10.1109/eptc62800.2024.10909806