Deep Learning Enhanced Thermal Simulation for Efficient Semiconductor Layout Design Using Thermal Twin
Bin He; Weiyang Miao; Gongyue Tang
- Published
- Publisher
- IEEE
- Journal / collection
- 2025 IEEE 75th Electronic Components and Technology Conference (ECTC)
- Research area
- AI & compute
- Source type
- Conference paper
- DOI
- 10.1109/ectc51687.2025.00257
The original publisher provides the full text and its access options.
Cite this source
Bin He; Weiyang Miao; Gongyue Tang. Deep Learning Enhanced Thermal Simulation for Efficient Semiconductor Layout Design Using Thermal Twin. 2025 IEEE 75th Electronic Components and Technology Conference (ECTC). 2025-05-27. https://doi.org/10.1109/ectc51687.2025.00257