Numerical study of thermal safety of passive semiconductor bridges based on multiphysics field coupling
X Zhang; P Liu; JN Duan; F Feng
- Published
- Publisher
- IOP Publishing
- Journal / collection
- Journal of Physics: Conference Series
- Research area
- Semiconductors
- Source type
- Journal article
- DOI
- 10.1088/1742-6596/2891/2/022011
The original publisher provides the full text and its access options.
Cite this source
X Zhang; P Liu; JN Duan; F Feng. Numerical study of thermal safety of passive semiconductor bridges based on multiphysics field coupling. Journal of Physics: Conference Series. 2024-12-01. https://doi.org/10.1088/1742-6596/2891/2/022011