Thermal Performance Of Cold Plate Cooling Of Sic Power Transistor In TO 247 Package
Veronika Śvárna; Michal Frivaldský
- Published
- Publisher
- IEEE
- Journal / collection
- 2024 International Symposium on Power Electronics, Electrical Drives, Automation and Motion (SPEEDAM)
- Research area
- Semiconductors
- Source type
- Conference paper
- DOI
- 10.1109/speedam61530.2024.10609203
The original publisher provides the full text and its access options.
Cite this source
Veronika Śvárna; Michal Frivaldský. Thermal Performance Of Cold Plate Cooling Of Sic Power Transistor In TO 247 Package. 2024 International Symposium on Power Electronics, Electrical Drives, Automation and Motion (SPEEDAM). 2024-06-19. https://doi.org/10.1109/speedam61530.2024.10609203