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Research literature / Conference paper

Soldering Defect Identification Using Deep Learning and Machine Learning Approach

Swati Shilaskar; Sai Singar; Abhijit Sonawane; Shobit Shinde

Published
Publisher
IEEE
Journal / collection
2024 First International Conference on Electronics, Communication and Signal Processing (ICECSP)
Research area
AI & compute
Source type
Conference paper
DOI
10.1109/icecsp61809.2024.10698480

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Swati Shilaskar; Sai Singar; Abhijit Sonawane; Shobit Shinde. Soldering Defect Identification Using Deep Learning and Machine Learning Approach. 2024 First International Conference on Electronics, Communication and Signal Processing (ICECSP). 2024-08-08. https://doi.org/10.1109/icecsp61809.2024.10698480

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