Epoxy Molding Compound Bleeding Reduction on Surface Mount Semiconductor Device
Federico Leone; Fulvio Viviani; Hidetoshi Seki; Masami Ishii
- Published
- Publisher
- IMAPS - International Microelectronics Assembly and Packaging Society
- Journal / collection
- IMAPSource Proceedings
- Research area
- Semiconductors
- Source type
- Journal article
- DOI
- 10.4071/001c.94760
The original publisher provides the full text and its access options.
Cite this source
Federico Leone; Fulvio Viviani; Hidetoshi Seki; Masami Ishii. Epoxy Molding Compound Bleeding Reduction on Surface Mount Semiconductor Device. IMAPSource Proceedings. 2024-03-06. https://doi.org/10.4071/001c.94760