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Research literature / Conference paper

Semiconductor MEMS WaferBond Membrane Deflection Prediction from Infrared Images Using Deep Learning based Vision Models

Fiete Stoll; Adarsh Kaladan; Vikas Dubey; Kevin Diex; Dirk Wünsch; Jan Langer; Monu Mishra; Maik Wiemer

Published
Publisher
IEEE
Journal / collection
2024 IEEE 26th Electronics Packaging Technology Conference (EPTC)
Research area
AI & compute
Source type
Conference paper
DOI
10.1109/eptc62800.2024.10909686

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Fiete Stoll; Adarsh Kaladan; Vikas Dubey; Kevin Diex; Dirk Wünsch; Jan Langer; Monu Mishra; Maik Wiemer. Semiconductor MEMS WaferBond Membrane Deflection Prediction from Infrared Images Using Deep Learning based Vision Models. 2024 IEEE 26th Electronics Packaging Technology Conference (EPTC). 2024-12-03. https://doi.org/10.1109/eptc62800.2024.10909686

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