A Method for Separation of Power Semiconductor Packaging-Related Wear-Out Mechanisms Under Converter Operation
Yingzhou Peng; Haoran Wang; Huai Wang
- Published
- Publisher
- Institute of Electrical and Electronics Engineers (IEEE)
- Journal / collection
- IEEE Transactions on Industrial Electronics
- Research area
- Semiconductors
- Source type
- Journal article
- DOI
- 10.1109/tie.2023.3273269
The original publisher provides the full text and its access options.
Cite this source
Yingzhou Peng; Haoran Wang; Huai Wang. A Method for Separation of Power Semiconductor Packaging-Related Wear-Out Mechanisms Under Converter Operation. IEEE Transactions on Industrial Electronics. 2024-04. https://doi.org/10.1109/tie.2023.3273269