Advancements in metrology for advanced semiconductor packaging
Wei-Hsin Chein; Gaurav Pandey; Surajit Das; Liang-Chia Chen
- Published
- Publisher
- SPIE
- Journal / collection
- Optics and Photonics for Advanced Dimensional Metrology III
- Research area
- Semiconductors
- Source type
- Conference paper
- DOI
- 10.1117/12.3024745
The original publisher provides the full text and its access options.
Cite this source
Wei-Hsin Chein; Gaurav Pandey; Surajit Das; Liang-Chia Chen. Advancements in metrology for advanced semiconductor packaging. Optics and Photonics for Advanced Dimensional Metrology III. 2024-06-18. https://doi.org/10.1117/12.3024745